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SiP technology was proposed in the 1990s, has been accepted and flourished in the industry for more than 20 years, and still has a large space for development in the foreseeable future.
View MoreBy improving the fixture of the inductively coupled plasma (ICP) device, the heat conduction efficiency of the back helium was improved, the temperature difference between the bottom electrode base and the wafer surface was reduced, and the cooling effect was improved. The effects of RF power, ICP power, bottom electrode base temperature, chamber pressure and other parameters on the etching rate, selection ratio, inclination Angle and side wall smoothness of the through-hole on the back of SiC w
View MoreChinese manufacturing industry is in the critical period of industrial upgrading. In the era of Industry 4.0, the flexible production characterized by customization, variety, small batch and multiple batches will replace the traditional large-scale production mode of a single product, which puts forward more refined, more timely and more flexible requirements for logistics. Only by making all "things" in the production process intelligently linked and keeping up with the rhythm of production, ca
View MoreUltrasonic welding has the advantages of high efficiency, high speed and automatic, compared with the traditional welding process has become the basic welding process in semiconductor packaging.
View MoreCompared to flip packaging technology, fan-out packaging has a smaller surface area, no substrate and intermediary layer, reduced thickness, increased pin number density, lower thermal impedance, better electrical performance, and higher potential system-level packaging and 3D integration capabilities to better meet the end market needs for product performance and volume.
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