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SiP is an important implementation path beyond Moore's Law.
View MoreA wafer probe is a machine used to test integrated circuits (automatic test equipment).
View MorePower Amplifier (PA, Power Amplifier), is an important part of various wireless transmitters, is one of the most important RF front-end devices. The power of the radio frequency signal generated by the modulating oscillation circuit is amplified to output to the antenna for radiation. The performance of PA directly determines the communication distance, signal quality and standby time of the wireless terminal, and is also the largest power consumption device in the RF front-end.
View MoreMEMS devices utilize semiconductor processing techniques to manufacture three-dimensional mechanical structures, and the three most commonly used MEMS manufacturing techniques include Bulk Micro Machining, Surface Micro Machining, and LIGA.
View MoreSiC is mainly used to achieve small weight and lightweight drive systems such as electric vehicle inverters. The advantages of SiC devices over Si devices are lower energy loss, easier miniaturization and higher temperature resistance. SiC is suitable for high pressure field, GaN is more suitable for low pressure and high frequency field.
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