With the increasingly strict requirements for portability and multi-function of consumer electronic products, integrating more functions, improving product efficiency, final thinness and reducing the overall cost of manufacturers have gradually become the development direction of terminal products and industry manufacturers.

However, with the approaching limit of Moore's Law, the semiconductor packaging industry has been faced with the dilemma of being unable to improve the performance of electronic products at the size of microchips.

Therefore, throughout the development of Packaging technology, from metal wire frame to wire packaging, crystal encapsulation (FCBGA) and then to Fan-in-Packaging and Fan-out packaging and other advanced packaging technology, It can be seen that the trend of its technology upgrade is to accommodate more I/O numbers, reduce chip size and thickness, integrate more heterogeneous chips to meet the needs of package miniaturization, while effectively reducing production costs, and ultimately applied to consumer, high-speed computing and professional electronic products and other applications.

Fan-out Panel Level Package (FOPLP) for fan-out Packages

According to the status quo of the industry, it can be seen that the current mainstream packaging technology is still dominated by wire packaging, but with the development trend of emerging technologies such as 5G and IOT and the thin requirements of consumer electronics products, the proportion of Flip chip is gradually increasing.

Compared to flip packaging technology, fan-out packaging has a smaller surface area, no substrate and intermediary layer, reduced thickness, increased pin number density, lower thermal impedance, better electrical performance, and higher potential system-level packaging and 3D integration capabilities to better meet the end market needs for product performance and volume.

The packaging industry is actively investing in fan-out packaging technology, reducing the size of the package by relaying the line layer to connect the chip with the passive component, or through the new vertically integrated three-dimensional integrated circuit (3D IC), by changing the way the chip is assembled and interconnected in the system, while taking into account cost and performance. Integrating heterogeneous chips in a single package.



Fan-out packaging technology is divided into fan-out wafer-level packaging (FOWLP) and fan-out panel level packaging (FOPLP) two types, although the two technical routes and applications are different, but can make the product to achieve a thinner appearance. The cost advantage of FOPLP compared with FOWLP has made it the reason for much attention in recent years. FOPLP's technology development improves chip performance and heat dissipation, while meeting the market demand for chip miniaturization and cost reduction. At present, FOPLP is divided into two technologies based on FPD process equipment and PCB carrier process.

Fan-out wafer-level package VS fan-out panel-level package



As can be seen from the chart below: the evolution of the packaging industry's business model and market sales are tilted toward Foundry and IDM, and fan-out packaging will gradually become an important role.

Data source: Yole Developpement



Among them, the current pattern of fan-out package is: high order fan-out package represented by Foundry manufacturer TSMC, middle and low level fan-out package represented by IDM factory Samsung Electric, and middle and low order fan-out package represented by OSAT factory Licheng. However, its future evolution trend is towards high order fan-out package.

The market value evolution forecast is as follows:

Data source: Yole Developpement



Among them, the current pattern of fan-out package is: high order fan-out package represented by Foundry manufacturer TSMC, middle and low level fan-out package represented by IDM factory Samsung Electric, and middle and low order fan-out package represented by OSAT factory Licheng. However, its future evolution trend is towards high order fan-out package.

The market value evolution forecast is as follows:

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