4 steps to illustrate MEMS chip manufacturing
Author：A

MEMS sensor is the most popular sensor manufacturing technology today, and it is also an important promotion of sensor miniaturization and intelligence, and MEMS technology has promoted the great development of sensors.

MEMS mainly uses microelectronics technology to shape the mechanical structure of the sensor in the volume of micro and nano. In the most clear way, this article illustrates the manufacturing process and principle of MEMS sensor chip visually!

MEMS is the abbreviation of Micro Electro Mechanical Systems (micro-electro-mechanical systems), with a tiny three-dimensional structure (three-dimensional structure), is a general term for systems that process various input and output signals. It is a high value-added component that integrates mechanical parts, electronic circuits, sensors and actuators on a circuit board using micro-machining technology.

MEMS process is based on conventional semiconductor process such as film forming process, lithography process and etching process.

Some key technologies of MEMS process are introduced below.

SOI wafer

SOI, short for Silicon On Insulator, refers to a silicon wafer that forms a single crystalline silicon layer on top of an oxide film. It has been widely used in power components and MEMS, where the oxide film layer can be used as the barrier layer for silicon etching, so complex three-dimensional structures can be formed.

TAIKO Grinding "TAIKO" is a trademark of DISCO Corporation

TAIKO grinding is a technology developed by DISCO that keeps the outermost edge of the wafer when grinding, and only grinds its inside.

TAIKO grinding has the advantages of "reduced wafer curvature", "higher wafer strength", "easy handling", and "higher integration with other processes" compared to normal grinding.

Wafer bonding/hot strip process

Thin wafers can be easily treated by using support wafers and hot strip wafers.

Wafer bonding

Wafer bonding is roughly divided into two categories: "direct bonding" and "bonding through the intermediate layer".

Direct bonding, which does not use adhesives, is a bonding that uses intermolecular forces generated by heat treatment to bond wafers to each other, and is used to make SOI wafers.

Bonding through an intermediate layer is a bonding method that makes wafers bond to each other by means of adhesives, etc.

Disclaimer: The contents of this article are the author's personal views and do not represent the views or positions of Kaiyi Technology. For more views, please contact us.

If you are interested in this article, please immediatelycontact us

Back

Company Name:
Name:
Position:
Phone:
Email:
Content:
Verification Code:

4 steps to illustrate MEMS chip manufacturing Author：A

4 steps to illustrate MEMS chip manufacturing
Author：A