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Advanced process refers to the changes and new systems brought by microelectronics technology, automation technology, information technology and other advanced technologies to the wafer manufacturing technology of the integrated circuit industry.
View MoreWafer Level Package (WLP) is a modified and enhanced CSP based on BGA technology. Some people also refer to WLP as chip level Chip Size Package (WLP-CSP). Wafer-level packaging technology takes wafers as processing objects, packages, ages and tests many chips on wafers at the same time, and finally cuts them into a single device, which can be mounted directly to the substrate or printed circuit board. It reduces the package size to the size of the IC chip, and the production cost is greatly redu
View MoreAt present, due to the rising storage density of Flash Memory storage devices and the continuous updating of chip production process nodes, the process within 20 nm is becoming more and more common in the manufacturing of memory devices. The continuous expansion of line width not only brings challenges to manufacturing, but also brings new challenges to the X-ray inspection during the assembly process. The experiment proves that the memory chip will lose the data due to the electronic transition
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