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The first wafer-level SiP Advanced packaging production line and conference of Shenzhen Kaiyi Technology Co., Ltd. was successfully concluded in Shenzhen International Convention and Exhibition Center on September 29, 2021.
At 10:30 on 27 September 2021, ELEXCO 2021 will host the Wafer-Level SiP Advanced Packaging Conference, which will provide a platform for information sharing, sharing of achievements and experiences, and discussing the opportunities and challenges in
ELEXCON 2021 will be held in Shenzhen International Convention and Exhibition Center on September 27. Together with the organizers and well-known equipment and material manufacturers in the industry, Kaiyi Technology will build a complete wafer-level
From September 27 to 29, 2021, the first "Wafer level SiP Advanced Packaging production line" in South China built by Shenzhen Kaiyi and hosted by 2021 Shenzhen International Electronics Fair will be displayed in Hall 8G46 of Shenzhen International C
The first wafer-level SiP advanced packaging production line in South China will be unveiled at the Shenzhen International Electronics Show ELEXCON 2021, which aims to present a complete visual production process on site and provide superior solution
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