Shenzhen KANA Technology Co., LTD., as the technical partner of Shenzhen International Electronics Fair (ELEXCON 2022), will join hands with well-known equipment and material providers in the industry to set up advanced SiP packaging production line in South China at the exhibition site. There will be a large gathering of celebrities at the exhibition site to share the latest process technology with the industry and discuss the development trend of the industry. At the same time, there are also speech forums in the region, where we invite the world's top equipment suppliers to share cutting-edge technologies and market development direction.
Wafer-level SiP advanced production line
Expo: Shenzhen ElEXCON 2022
When: November 5-7, 2022
Venue: Shenzhen Futian Convention and Exhibition Center, Hall 9, 9L32
Scale: more than 40,000 offline employees
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Visit the wafer-level SiP advanced production line to find a comprehensive SIP solution:
- Highly flexible and suitable for MCM,SIP,FOWLP and flip chip
- High UPH, accuracy up to 7um@3σ
- High pass through rate
- High reliability placement and connection technology
Speech agenda02
The two-day forum will feature 10 speakers, ranging from academics to industry, who will delve into trends in semiconductor SiP advanced packaging technologies, markets and applications.
speaker
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10 speakers, well-known academic and industry leaders.
